Three low density materials
were considered for the interface frame:
- High Performance, High Temperature Polymer -- Polyimide
- Structural Magnesium Alloy - AZ91D
- Structural Aluminum Alloy - A356
| |
Polyimide |
Magnesium |
Aluminum |
| Density (g/cc) |
1.43 |
1.81 |
2.68 |
| Elastic Modulus (MSI) |
0.45 |
6.5 |
10.5 |
| Thermal Conductivity (W/mK) |
0.25 |
72 |
150 |
| Thermal Expansion (10^-6/K) |
57 |
26 |
22 |
| Deflection/Solidus
Temperature (C) |
360 (D) |
470 (S) |
555 (S) |
| Ultimate Tensile Strength
(ksI) |
12.5 |
33 |
38 |
|
| Which material (polyimide, magnesium, or aluminum) best meets the requirements for low density, high modulus, high
thermal conductivity, low thermal expansion, high temperature stability, and high tensile
strength? |
|
